发明授权
- 专利标题: Carrier for test, burn-in, and first level packaging
- 专利标题(中): 用于测试,老化和一级包装的载体
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申请号: US11531140申请日: 2006-09-12
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公开(公告)号: US07394268B2公开(公告)日: 2008-07-01
- 发明人: Claude L. Bertin , Wayne F. Ellis , Mark W. Kellogg , William R. Tonti , Jerzy M. Zalesinski , James M. Leas , Wayne J. Howell
- 申请人: Claude L. Bertin , Wayne F. Ellis , Mark W. Kellogg , William R. Tonti , Jerzy M. Zalesinski , James M. Leas , Wayne J. Howell
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理机构: Connolly Bove Lodge & Hutz LLP
- 代理商 Anthony Canale
- 主分类号: G01R31/02
- IPC分类号: G01R31/02
摘要:
A plurality of semiconductor devices are provided on a carrier for testing or burning-in. The carrier is then cut up to provide single chip-on-carrier components or multi-chip-on-carrier components. The carrier is used as a first level package for each chip. Thus, the carrier serves a dual purpose for test and burn-in and for packaging. A lead reduction mechanism, such as a built-in self-test engine, can be provided on each chip or on the carrier and is connected to contacts of the carrier for the testing and burn-in steps. The final package after cutting includes at least one known good die and may include an array of chips on the carrier, such as a SIMM or a DIMM. The final package can also be a stack of chips each mounted on a separate carrier. The carriers of the stack are connected to each other through a substrate mounted along a side face of the stack that is electrically connected to a line of pads along an edge of each carrier.
公开/授权文献
- US20070001708A1 CARRIER FOR TEST, BURN-IN, AND FIRST LEVEL PACKAGING 公开/授权日:2007-01-04