Invention Grant
US07395722B2 Mechanical property measurement of thin films by micro plane-strain compression
失效
通过微平面应变压缩对薄膜进行机械性能测量
- Patent Title: Mechanical property measurement of thin films by micro plane-strain compression
- Patent Title (中): 通过微平面应变压缩对薄膜进行机械性能测量
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Application No.: US11602522Application Date: 2006-11-21
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Publication No.: US07395722B2Publication Date: 2008-07-08
- Inventor: Li Lin
- Applicant: Li Lin
- Applicant Address: US DE Wilmington
- Assignee: E.I. du Pont de Nemours and Company
- Current Assignee: E.I. du Pont de Nemours and Company
- Current Assignee Address: US DE Wilmington
- Agent Sudhir G. Deshmukh
- Main IPC: G01D1/16
- IPC: G01D1/16
Abstract:
This invention is directed to the measurement of stress-strain relationships in thin films using substantially flat, parallel test surfaces with minimal width. This invention is further directed to the measurement of stress-strain relationships in thin films at controlled temperatures and at high strain rates above 100% per second.
Public/Granted literature
- US20070186670A1 Mechanical property measurement of thin films by micro plane-strain compression Public/Granted day:2007-08-16
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