Invention Grant
US07396703B1 Method of making a semiconductor chip assembly with a bumped terminal and a filler
有权
制造具有凸起端子和填料的半导体芯片组件的方法
- Patent Title: Method of making a semiconductor chip assembly with a bumped terminal and a filler
- Patent Title (中): 制造具有凸起端子和填料的半导体芯片组件的方法
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Application No.: US11603805Application Date: 2006-11-22
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Publication No.: US07396703B1Publication Date: 2008-07-08
- Inventor: Charles W. C. Lin , Cheng-Chung Chen
- Applicant: Charles W. C. Lin , Cheng-Chung Chen
- Applicant Address: TW Taipei
- Assignee: Bridge Semiconductor Corporation
- Current Assignee: Bridge Semiconductor Corporation
- Current Assignee Address: TW Taipei
- Agent David M. Sigmond
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/48 ; H01L21/50
Abstract:
A method of making a semiconductor chip assembly includes providing a metal base, a routing line, a bumped terminal and a filler, wherein the routing line contacts the bumped terminal and the filler, then mechanically attaching a semiconductor chip to the metal base, the routing line, the bumped terminal and the filler, then forming an encapsulant, then etching the metal base to expose the bumped terminal, and then grinding the bumped terminal to expose the filler.
Information query
IPC分类:
