发明授权
- 专利标题: Semiconductor apparatus and production method thereof suitable for electric power devices
- 专利标题(中): 适用于电力设备的半导体装置及其制造方法
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申请号: US11029915申请日: 2005-01-04
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公开(公告)号: US07397116B2公开(公告)日: 2008-07-08
- 发明人: Hiroyuki Onishi , Toshiaki Nagase , Jun Ishikawa , Koichi Akagawa
- 申请人: Hiroyuki Onishi , Toshiaki Nagase , Jun Ishikawa , Koichi Akagawa
- 申请人地址: unknown Kariya-shi, Toyota
- 专利权人: Kabushiki Kaisha Toyota Jidoshokki
- 当前专利权人: Kabushiki Kaisha Toyota Jidoshokki
- 当前专利权人地址: unknown Kariya-shi, Toyota
- 代理机构: Morgan&Finnegan,LLP
- 优先权: JP2004-003174 20040108
- 主分类号: H01L23/52
- IPC分类号: H01L23/52 ; H01L23/48
摘要:
A semiconductor apparatus is characterized in that it comprises a semiconductor module having a plurality of semiconductor elements and an external connection terminal for externally connecting electrodes of the semiconductor elements in the semiconductor module, wherein the semiconductor elements in each semiconductor module are connected in parallel and/or in series via the external connection terminal.
公开/授权文献
- US20050151167A1 Semiconductor apparatus and a production method thereof 公开/授权日:2005-07-14