发明授权
- 专利标题: Laser annealing apparatus and annealing method of semiconductor thin film using the same
- 专利标题(中): 激光退火装置及使用其的半导体薄膜的退火方法
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申请号: US10986936申请日: 2004-11-15
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公开(公告)号: US07397831B2公开(公告)日: 2008-07-08
- 发明人: Mikio Hongo , Akio Yazaki , Mutsuko Hatano
- 申请人: Mikio Hongo , Akio Yazaki , Mutsuko Hatano
- 申请人地址: JP Mobara-Shi
- 专利权人: Hitachi Displays, Ltd.
- 当前专利权人: Hitachi Displays, Ltd.
- 当前专利权人地址: JP Mobara-Shi
- 代理机构: Antonelli, Terry, Stout & Kraus, LLP.
- 优先权: JP2004-022461 20040130
- 主分类号: H01S3/00
- IPC分类号: H01S3/00
摘要:
A laser beam temporally modulated in amplitude by a modulator and shaped into a long and narrow shape by a beam shaper is rotated around the optical axis of an image rotator inserted between the beam shaper and a substrate. Thus, the longitudinal direction of the laser beam having the long and narrow shape is rotated around the optical axis on the substrate. In order to perform annealing in a plurality of directions on the substrate, the laser beam shaped into the long and narrow shape is rotated on the substrate while a stage mounted with the substrate is moved only in two directions, that is, X- and Y-directions.In such a manner, the substrate can be scanned at a high speed with a continuous wave laser beam modulated temporally in amplitude and shaped into a long and narrow shape, without rotating the substrate. Thus, a semiconductor film can be annealed.
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