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US07399668B2 Method for making electronic devices having a dielectric layer surface treatment
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制造具有电介质层表面处理的电子器件的方法
- 专利标题： Method for making electronic devices having a dielectric layer surface treatment
- 专利标题（中）： 制造具有电介质层表面处理的电子器件的方法
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申请号： US10954413申请日： 2004-09-30
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公开(公告)号： US07399668B2公开(公告)日： 2008-07-15
- 发明人: Timothy D. Dunbar , Tommie W. Kelley
- 申请人： Timothy D. Dunbar , Tommie W. Kelley
- 申请人地址： US MN St. Paul
- 专利权人： 3M Innovative Properties Company
- 当前专利权人： 3M Innovative Properties Company
- 当前专利权人地址： US MN St. Paul
- 代理商 Lisa P. Fulton; Nicole J. Einerson; John M. Bronk
- 主分类号： H01L21/8238
- IPC分类号： H01L21/8238
摘要：
A method of making an electronic device by (a) depositing a substantially nonfluorinated polymeric layer onto a dielectric layer using a plasma-based deposition technique selected from the group consisting of (i) plasma polymerizing a precursor comprising monomers, and (ii) sputtering from a target comprising one or more polymers of interpolymerized units of monomers, the monomers being selected from the group consisting of aromatic monomers, substantially hydrocarbon monomers, and combinations thereof; and (b) depositing an organic semiconductor layer adjacent to said polymeric layer.
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