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发明授权
US07400049B2 Integrated circuit package system with heat sink 有权
集成电路封装系统带散热片

Integrated circuit package system with heat sink
摘要：
An integrated circuit package system is provided forming an external interconnect from a padless lead frame, encapsulating a heat sink and the external interconnect, mounting an integrated circuit die on the heat sink, and encapsulating the integrated circuit die, the heat sink, and the external interconnect.
摘要（中）：

提供一种集成电路封装系统，其形成来自无引脚引线框架的外部互连，封装散热器和外部互连，将集成电路管芯安装在散热器上，以及封装集成电路管芯，散热器和外部 互连。

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