发明授权
- 专利标题: Circuit board electrode connection structure
- 专利标题(中): 电路板电极连接结构
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申请号: US11150741申请日: 2005-06-10
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公开(公告)号: US07400515B2公开(公告)日: 2008-07-15
- 发明人: Yasuhiro Sakamoto , Tomoyuki Sagara , Yoshinori Nakajima
- 申请人: Yasuhiro Sakamoto , Tomoyuki Sagara , Yoshinori Nakajima
- 申请人地址: JP Osaka
- 专利权人: Sharp Kabushiki Kaisha
- 当前专利权人: Sharp Kabushiki Kaisha
- 当前专利权人地址: JP Osaka
- 代理机构: Edwards Angell Palmer & Dodge LLP
- 代理商 David G. Conlin; Steven M. Jensen
- 优先权: JP2004-185351 20040623
- 主分类号: H05K1/14
- IPC分类号: H05K1/14
摘要:
An electrode connection structure between outer lead(s) of TCP(s), being first circuit board(s), and actuator member electrode(s) for connection to external circuitry, being second circuit board(s); actuator member(s) electrode(s) for connection to external circuitry being formed in or on floor(s) of recess(es) which is/are step(s) smaller in magnitude than thickness(es) of outer lead(s) protruding from polyimide substrate(s) of TCP(s); adhesive(s) having thickness(es) more or less equal to difference(s) between step(s) and thickness(es) of outer lead(s); and outer lead(s) being electrically and mechanically connected to electrode(s) for connection to external circuitry.
公开/授权文献
- US20050286240A1 Circuit board electrode connection structure 公开/授权日:2005-12-29
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