Invention Grant
- Patent Title: High thermal conductive element, method for manufacturing same, and heat radiating system
- Patent Title (中): 高导热元件,制造方法及散热系统
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Application No.: US11822334Application Date: 2007-07-05
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Publication No.: US07402340B2Publication Date: 2008-07-22
- Inventor: Toyokazu Ozaki , Akira Taomoto , Mitsuru Hashimoto , Masahiro Deguchi , Motoshi Shibata
- Applicant: Toyokazu Ozaki , Akira Taomoto , Mitsuru Hashimoto , Masahiro Deguchi , Motoshi Shibata
- Applicant Address: JP Osaka
- Assignee: Matsushita Electric Industrial Co., Ltd.
- Current Assignee: Matsushita Electric Industrial Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2003-300892 20030826; JP2003-353443 20031014; JP2004-82235 20040322
- Main IPC: B32B9/00
- IPC: B32B9/00

Abstract:
It is an object of the present invention to provide a high thermal conductive element that has improved thermal conductivity in the layer direction while retaining the high thermal conductivity characteristics in the planar direction possessed by graphite. The present invention is a high thermal conductive element in which carbon particles are dispersed in a graphite-based matrix, wherein (1) the c axis of the graphene layers constituting the graphite are substantially parallel, (2) the thermal conductivity κ∥ in a direction perpendicular to the c axis is at least 400 W/m·k and no more than 1000 W/m·k, and (3) the thermal conductivity κ⊥ in a direction parallel to the c axis is at least 10 W/m·k and no more than 100 W/m·k.
Public/Granted literature
- US20070259186A1 High thermal conductive element, method for manufacturing same, and heat radiating system Public/Granted day:2007-11-08
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