发明授权
- 专利标题： Method for chemically mechanically polishing organic film, method of manufacturing semiconductor device, and program therefor
- 专利标题（中）： 化学机械抛光有机膜的方法，制造半导体器件的方法及其程序
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申请号： US11418070申请日： 2006-05-05
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公开(公告)号： US07402521B2公开(公告)日： 2008-07-22
- 发明人: Yukiteru Matsui , Gaku Minamihaba , Atsushi Shigeta , Hiroyuki Yano
- 申请人： Yukiteru Matsui , Gaku Minamihaba , Atsushi Shigeta , Hiroyuki Yano
- 申请人地址： JP Tokyo
- 专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人地址： JP Tokyo
- 代理机构： Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- 优先权： JP2005-193001 20050630
- 主分类号： H01L21/302
- IPC分类号： H01L21/302
摘要：
There is proposed a polishing method. The method includes feeding a slurry onto a polishing pad, press-contacting a semiconductor substrate held on a polishing head with the polishing pad, the semiconductor substrate having an organic film thereon, and chemically mechanically polishing the organic film by repeating a sequence of rotation and halt of rotation of the polishing pad and the polishing head.