发明授权
- 专利标题： Wiring substrate and method for manufacturing the same
- 专利标题（中）： 接线基板及其制造方法
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申请号： US10664158申请日： 2003-09-17
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公开(公告)号： US07405365B2公开(公告)日： 2008-07-29
- 发明人: Hajime Imai , Osamu Sugimoto , Katsuhiro Okada , Isao Ogasawara
- 申请人： Hajime Imai , Osamu Sugimoto , Katsuhiro Okada , Isao Ogasawara
- 申请人地址： JP Osaka
- 专利权人： Sharp Kabushiki Kaisha
- 当前专利权人： Sharp Kabushiki Kaisha
- 当前专利权人地址： JP Osaka
- 代理机构： Birch, Stewart, Kolasch & Birch, LLP
- 优先权： JP2002-291085 20021003
- 主分类号： H05K1/16
- IPC分类号： H05K1/16
摘要：
A wiring substrate of the present invention includes a short ring (SR) formed along a periphery of the substrate, an independent line pattern (e.g., a gate terminal) that is coplanar with and independent of SR, a continuous line pattern (e.g., a storage capacitor stem) that is located closest to the independent line pattern and is coplanar and continuous with SR, and an insulating film covering the independent line pattern and the continuous line pattern. The insulating film includes a first through hole reaching the independent line pattern and a second through hole reaching the continuous line pattern.
公开/授权文献
- US20040066637A1 Wiring substrate and method for manufacturing the same 公开/授权日：2004-04-08