发明授权
- 专利标题: Automotive floor panel assembly
- 专利标题(中): 汽车地板组装
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申请号: US11370431申请日: 2006-03-08
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公开(公告)号: US07407223B2公开(公告)日: 2008-08-05
- 发明人: Hideaki Ito , Hirokuni Kumekawa
- 申请人: Hideaki Ito , Hirokuni Kumekawa
- 申请人地址: JP Tokyo
- 专利权人: Honda Motor Co., Ltd.
- 当前专利权人: Honda Motor Co., Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Rankin, Hill & Clark LLP
- 优先权: JP2005-067671 20050310
- 主分类号: B60J7/00
- IPC分类号: B60J7/00
摘要:
In an automotive floor panel assembly comprising a floor panel (1) stamp-formed of sheet metal and including a recess (21, 22) defining an upper concave surface and a lower convex surface, a compound longitudinal floor frame is formed by a lower reinforcement (24) extending longitudinally across a part of the lower convex surface of the floor panel and an upper reinforcement (25) extending longitudinally across a part of the upper concave surface of the floor panel. The lower and upper reinforcements include a first vertical wall having an upper edge closely following a contour of the lower convex surface a second vertical wall having a lower edge closely following a contour of the supper concave surface, respectively. The compound longitudinal floor frame is thus provided with a substantially constant cross section and extends substantially linearly over the entire length of the floor panel and hereby. Therefore, the height of a lowest part of the floor panel from the ground surface is prevented from being reduced, and the mechanical strength of the floor panel would not be compromised even when the floor pane is provided with a downward projection.
公开/授权文献
- US20060214473A1 Automotive floor panel assembly 公开/授权日:2006-09-28
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