A three-dimensional moulded planar cable, includes a laminate made from at least one conductor track, bonded between two insulation layers and at least one support layer, connected to each other by an adhesive layer. The cable is applied to a positive moulding tool, brought into shape by the application of heat and/or radiation and/or pressure and fixed in the three-dimensional shape thereof by cooling to below the glass temperature Tg of the adhesive layer or by hardening of the adhesive layer.