Invention Grant
US07408189B2 Method of testing FPC bonding yield and FPC having testing pads thereon
有权
测试FPC接合成品率的方法及其上具有测试垫的FPC
- Patent Title: Method of testing FPC bonding yield and FPC having testing pads thereon
- Patent Title (中): 测试FPC接合成品率的方法及其上具有测试垫的FPC
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Application No.: US11408685Application Date: 2006-04-20
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Publication No.: US07408189B2Publication Date: 2008-08-05
- Inventor: Chia-Cheng Lin
- Applicant: Chia-Cheng Lin
- Applicant Address: TW Chu-Nan
- Assignee: TPO Displays Corp.
- Current Assignee: TPO Displays Corp.
- Current Assignee Address: TW Chu-Nan
- Agency: Liu & Liu
- Main IPC: H01L23/58
- IPC: H01L23/58
Abstract:
A flexible printed circuit (FPC) having testing pads thereon is provided. The FPC comprises a plurality of bonding pads and a plurality of testing pads, wherein each of the testing pads is disposed corresponding to each of the bonding pads, and the testing pads are electrically isolated from the bonding pads. After the bonding pads of the FPC are bonded to pins of a display, the testing pads are electrically connected to the bonding pads on the FPC via the pins of the display. Therefore, the FPC bonding yield can be determined by measuring the electrical property of the testing pads.
Public/Granted literature
- US20060189010A1 Method of testing FPC bonding yield and FPC having testing pads thereon Public/Granted day:2006-08-24
Information query
IPC分类:
