Invention Grant
- Patent Title: Method for non-damaging charge injection and system thereof
- Patent Title (中): 无损电荷注入方法及其系统
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Application No.: US11712724Application Date: 2007-03-01
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Publication No.: US07408236B2Publication Date: 2008-08-05
- Inventor: Michael D. Potter
- Applicant: Michael D. Potter
- Applicant Address: US NY Churchville
- Assignee: Nth Tech
- Current Assignee: Nth Tech
- Current Assignee Address: US NY Churchville
- Agency: Nixon Peabody LLP
- Main IPC: H01L29/00
- IPC: H01L29/00
Abstract:
A method and system for injecting charge includes providing a first material on a second material and injecting charge into the first material to trap charge at an interface between the first and second materials. The thickness of the first material is greater than a penetration depth of the injected charge in the first material.
Public/Granted literature
- US20070152776A1 Method for non-damaging charge injection and system thereof Public/Granted day:2007-07-05
Information query
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