An integrated circuit package includes at least two electronic circuits. A first of the at least two electronic circuits includes a digital input and a digital output and a test mode control line for setting the first integrated circuit chip into a determined test mode. The digital input includes at least two parallel input paths and the digital output includes at least two parallel output paths. The at least two parallel input paths and at least two parallel output paths provide a corresponding number of internal paths by which the first electronic circuit and a second electronic circuit can be tested essentially simultaneously.