发明授权
US07410833B2 Interconnections for flip-chip using lead-free solders and having reaction barrier layers
有权
使用无铅焊料并具有反应阻挡层的倒装芯片的互连
- 专利标题： Interconnections for flip-chip using lead-free solders and having reaction barrier layers
- 专利标题（中）： 使用无铅焊料并具有反应阻挡层的倒装芯片的互连
-
申请号： US10815103申请日： 2004-03-31
-
公开(公告)号： US07410833B2公开(公告)日： 2008-08-12
- 发明人: Keith E. Fogel , Balaram Ghosal , Sung K. Kang , Stephen Kilpatrick , Paul A. Lauro , Henry A. Nye, III , Da-Yuan Shih , Donna S. Zupanski-Nielsen
- 申请人： Keith E. Fogel , Balaram Ghosal , Sung K. Kang , Stephen Kilpatrick , Paul A. Lauro , Henry A. Nye, III , Da-Yuan Shih , Donna S. Zupanski-Nielsen
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理商 Daniel P. Morris; David Aker
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
An interconnection structure suitable for flip-chip attachment of microelectronic device chips to packages, comprising a two, three or four layer ball-limiting composition including an adhesion/reaction barrier layer, and having a solder wettable layer reactive with components of a tin-containing lead free solder, so that the solderable layer can be totally consumed during soldering, but a barrier layer remains after being placed in contact with the lead free solder during soldering. One or more lead-free solder balls is selectively situated on the solder wetting layer, the lead-free solder balls comprising tin as a predominant component and one or more alloying components.