- 专利标题: High performance FET devices and methods thereof
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申请号: US11067186申请日: 2005-02-26
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公开(公告)号: US07411214B2公开(公告)日: 2008-08-12
- 发明人: Jack Oon Chu
- 申请人: Jack Oon Chu
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理商 George Sai-Halasz; Robert M. Trepp
- 主分类号: H01L21/00
- IPC分类号: H01L21/00
摘要:
Structure and methods of fabrication are disclosed for an enhanced FET devices in which dopant impurities are prevented from diffusing through the gate insulator. The structure comprises a Si:C, or SiGe:C, layer which is sandwiched between the gate insulator and a layer which is doped with impurities in order to provide a preselected workfunction. It is further disclosed how this, and further improvements for FET devices, such as raised source/drain and multifaceted gate on insulator, MODFET on insulator are integrated with strained Si based layer on insulator technology.
公开/授权文献
- US20050156169A1 High performance FET devices and methods thereof 公开/授权日:2005-07-21
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