Invention Grant
- Patent Title: Component interconnect with substrate shielding
- Patent Title (中): 元件互连与基板屏蔽
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Application No.: US10882378Application Date: 2004-06-30
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Publication No.: US07411279B2Publication Date: 2008-08-12
- Inventor: Edward B. Stoneham , Thomas M. Gaudette
- Applicant: Edward B. Stoneham , Thomas M. Gaudette
- Applicant Address: US CA San Jose
- Assignee: Endwave Corporation
- Current Assignee: Endwave Corporation
- Current Assignee Address: US CA San Jose
- Agency: Kolish Hartwell PC
- Main IPC: H01L39/02
- IPC: H01L39/02

Abstract:
An example of a circuit structure may include a first dielectric layer having first and second surfaces, and a channel extending at least partially between the first and second surfaces and along a length of the first dielectric layer. First and second conductive layers may be disposed on respective portions of the first and second surfaces. A first conductor, having an end, may be disposed on a surface of the first dielectric layer, including at least a first portion extending around at least a portion of the conductor end. The second conductive layer may line the channel extending around a portion of the conductor end. Some examples may include a stripline having a second conductor connected to the first conductor. Some examples may include a cover having a wall positioned on the first dielectric over the second conductor.
Public/Granted literature
- US20060001129A1 Component interconnect with substrate shielding Public/Granted day:2006-01-05
Information query
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