发明授权
- 专利标题: Molding manufacturing method and apparatus
- 专利标题(中): 成型制造方法和装置
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申请号: US10720081申请日: 2003-11-25
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公开(公告)号: US07416693B2公开(公告)日: 2008-08-26
- 发明人: Yoshikazu Miwa , Akira Jinno , Masahito Yamada , Junichi Miyake , Tatsuya Tamura
- 申请人: Yoshikazu Miwa , Akira Jinno , Masahito Yamada , Junichi Miyake , Tatsuya Tamura
- 申请人地址: JP Aichi
- 专利权人: Tokai Kogyo Co., Ltd.
- 当前专利权人: Tokai Kogyo Co., Ltd.
- 当前专利权人地址: JP Aichi
- 代理机构: Westerman, Hattori, Daniels & Adrian, LLP.
- 优先权: JPP.2002-342648 20021126; JPP.2002-342649 20021126; JPP.2002-365393 20021217
- 主分类号: B29C59/16
- IPC分类号: B29C59/16 ; B29C47/04 ; B29C53/04
摘要:
A molding manufacturing method includes: preparing a molding body including a molding main body made of thermoplastic material and a decorative layer higher than the molding main body in hardness and melt temperature; setting the molding body in a fixed die; heating and softening an end portion of the molding body while maintaining the decorative layer softer than the molding main body, by irradiating an infrared ray onto a back surface of the molding main body corresponding to the end portion; and press forming the end portion of the molding body by applying a movable punch onto the fixed die while the end portion of the molding body is in a softened state to bend the end portion of the molding body to obtain an end cover portion having a predetermined shape.
公开/授权文献
- US20040156941A1 Molding manufacturing method and apparatus 公开/授权日:2004-08-12
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