发明授权
- 专利标题： Electromagnetic wave absorbing thermally conductive composition and thermosoftening electromagnetic wave absorbing heat dissipation sheet and method of heat dissipation work
- 专利标题（中）： 电磁波吸收导热组合物和热软化电磁波吸收散热片及散热工作方法
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申请号： US10250685申请日： 2002-03-20
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公开(公告)号： US07417078B2公开(公告)日： 2008-08-26
- 发明人: Hironao Fujiki , Kazuhiko Tomaru , Ikuo Sakurai , Akio Suzuki , Kunihiko Mita
- 申请人： Hironao Fujiki , Kazuhiko Tomaru , Ikuo Sakurai , Akio Suzuki , Kunihiko Mita
- 申请人地址： JP Tokyo
- 专利权人： Shin-Etsu Chemical Co., Ltd.
- 当前专利权人： Shin-Etsu Chemical Co., Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
- 优先权： JP2001-080870 20010321
- 国际申请： PCT/JP02/02667 WO 20020320
- 国际公布： WO02/075755 WO 20020926
- 主分类号： G21F1/10
- IPC分类号： G21F1/10 ; C08K3/10 ; C08K3/22 ; C08L83/06 ; H05K7/20
摘要：
An electromagnetic wave absorbing heat conductive composition is used to form an electromagnetic wave absorbing heat dissipating article that is placed between a heat generating electronic component which, when operated, generates heat, reaches a temperature higher than room temperature and acts as an electromagnetic wave generating source, and a heat dissipating component. The composition is non-fluid at room temperature prior to operation of the electronic component, but acquires a low viscosity, softens or melts under heat generation during operation of the electronic component, to fluidize at least a surface of the composition so that the composition substantially fills any gaps between the electronic component and the heat-dissipating component.
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