发明授权
- 专利标题： Thick film circuit board, method of producing the same and integrated circuit device
- 专利标题（中）： 厚膜电路板，其制造方法和集成电路器件
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申请号： US10831229申请日： 2004-04-26
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公开(公告)号： US07417318B2公开(公告)日： 2008-08-26
- 发明人: Tohru Nomura , Yoshihiro Shimoide , Yoshihiko Shiraishi , Rikiya Kamimura , Hiroshi Kasugai
- 申请人： Tohru Nomura , Yoshihiro Shimoide , Yoshihiko Shiraishi , Rikiya Kamimura , Hiroshi Kasugai
- 申请人地址： JP
- 专利权人： Denso Corporation
- 当前专利权人： Denso Corporation
- 当前专利权人地址： JP
- 代理机构： Nixon & Vanderhye PC
- 优先权： JP2003-122426 20030425; JP2004-057401 20040302
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
A thick film circuit board that can be produced at a low cost, a method of producing the same, and an integrated circuit device. A first thick film circuit board has conducting layers of a copper-containing conductor fired at not higher than 750° C., and includes conducting portions formed by using a silver-containing conductor. A second thick film circuit board has conductors that are formed in the through holes so as to close the openings of at least the one side thereof. The thick film circuit board is produced at a low cost and suppresses a drop in electric conductivity when it is in use.