发明授权
US07417827B2 Head/slider supporting structure having lead wire inclined relative to slider pad
失效
头/滑块支撑结构，其具有相对于滑块垫倾斜的导线
- 专利标题： Head/slider supporting structure having lead wire inclined relative to slider pad
- 专利标题（中）： 头/滑块支撑结构，其具有相对于滑块垫倾斜的导线
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申请号： US11071394申请日： 2005-03-02
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公开(公告)号： US07417827B2公开(公告)日： 2008-08-26
- 发明人: Hiroyasu Tsuchida , Tatsumi Tsuchiya , Takaaki Murokawa , Yuhsuke Matsumoto , Yoshio Uematsu , Tatsuya Tanaka
- 申请人： Hiroyasu Tsuchida , Tatsumi Tsuchiya , Takaaki Murokawa , Yuhsuke Matsumoto , Yoshio Uematsu , Tatsuya Tanaka
- 申请人地址： NL Amsterdam
- 专利权人： Hitachi Global Storage Technologies Netherlands B.V.
- 当前专利权人： Hitachi Global Storage Technologies Netherlands B.V.
- 当前专利权人地址： NL Amsterdam
- 代理机构： Townsend and Townsend and Crew LLP
- 代理商 Darren Gold
- 优先权： JP2004-058021 20040302
- 主分类号： G11B5/60
- IPC分类号： G11B5/60
摘要：
Embodiments of the invention provide a head/slider supporting structure which has connection properties excellent in solder ball connections of a slider pad and a lead pad. According to one embodiment, in a head/slider supporting structure for connecting a slider and a lead wire by re-flowing a solder ball, a connection distance between a slider pad and an extreme end portion of the lead wire is reduced to enhance the performance of solder connection. The lead wire is inclined forwardly of the slider pad.