A compact industrial process transmitter is provided having an electronics module that includes a top surface with a plurality of lead attachment points thereon. At least one of the lead attachment points disposed on the top surface of the compact temperature transmitter electronics module includes a upwardly extending external lead attachment clip. In some aspects, a plurality of upwardly extending lead attachment clips as well as lead attachment points that have a lead wire engaging surface that is substantially flush with or raised above the top surface of the compact temperature transmitter electronics module.