发明授权
- 专利标题： Substrate-cutting system, substrate-producing apparatus, substrate-scribing method, and substrate-cutting method
- 专利标题（中）： 基板切割系统，基板制造装置，基板划线方法和基板切割方法
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申请号： US10535871申请日： 2003-09-24
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公开(公告)号： US07426883B2公开(公告)日： 2008-09-23
- 发明人: Yoshitaka Nishio , Yasutomo Okajima , Yukio Oshima , Hiroyuki Onari , Kazuhiro Yoshimoto
- 申请人： Yoshitaka Nishio , Yasutomo Okajima , Yukio Oshima , Hiroyuki Onari , Kazuhiro Yoshimoto
- 代理机构： Renner, Otto, Boisselle & Sklar, LLP
- 优先权： JP2002-340054 20021122
- 国际申请： PCT/JP03/12182 WO 20030924
- 国际公布： WO2004/048057 WO 20040610
- 主分类号： B28D5/04
- IPC分类号： B28D5/04 ; B26D3/08
摘要：
A clamping device (50) is installed on a stand (10) with a hollow rectangular parallelepiped shape such that at least one place at a side edge portion of a mother board transported in the stand (10) is clamped. A pair of substrate-cutting devices for cutting the mother substrate, clamped by the clamping device (50), from its upper face and lower face is provided on a scribing device guide body (30). The scribing device guide body (30) is reciprocally movable along one side of the hollow rectangular parallelepiped. The pair of substrate-cutting devices is installed so as to be movable along the direction perpendicular to the movement direction of the scribing device guide body (30). The mother substrate clamped by the clamping device is supported by a substrate-supporting device (20).