Invention Grant
- Patent Title: Embroidered instrument cluster
- Patent Title (中): 绣花仪表组
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Application No.: US11073487Application Date: 2005-03-04
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Publication No.: US07431484B2Publication Date: 2008-10-07
- Inventor: Ching Fong
- Applicant: Ching Fong
- Applicant Address: US MI Canton
- Assignee: Yazaki North America, Inc.
- Current Assignee: Yazaki North America, Inc.
- Current Assignee Address: US MI Canton
- Agency: Harness, Dickey & Pierce, P.L.C.
- Main IPC: B60Q3/04
- IPC: B60Q3/04

Abstract:
An instrument cluster generally including a backing material and a plurality of fibers forming indicia that indicate a vehicle parameter. The plurality of fibers is coupled to the backing material. The instrument cluster also includes an illumination device that illuminates at least one of the backing material and the plurality of fibers.
Public/Granted literature
- US20060198117A1 Embroidered instrument cluster Public/Granted day:2006-09-07
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