发明授权
US07435911B2 Printed circuit board including embedded capacitor and method of fabricating same
有权
包括嵌入式电容器的印刷电路板及其制造方法
- 专利标题: Printed circuit board including embedded capacitor and method of fabricating same
- 专利标题(中): 包括嵌入式电容器的印刷电路板及其制造方法
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申请号: US11096411申请日: 2005-03-31
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公开(公告)号: US07435911B2公开(公告)日: 2008-10-14
- 发明人: Young Woo Kim , Byoung Youl Min , Chang Myung Ryu , Woo Lim Chae , Han Kim
- 申请人: Young Woo Kim , Byoung Youl Min , Chang Myung Ryu , Woo Lim Chae , Han Kim
- 申请人地址: KR Kyunggi-Do
- 专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址: KR Kyunggi-Do
- 代理机构: Darby & Darby P.C.
- 优先权: KR10-2004-0116807 20041230
- 主分类号: H05K1/16
- IPC分类号: H05K1/16
摘要:
Disclosed is a PCB including an embedded capacitor and a method of fabricating the same. The long embedded capacitor is formed through an insulating layer, making a high capacitance and various capacitance designs possible.