发明授权
- 专利标题： Enhanced mechanical strength via contacts
- 专利标题（中）： 通过触点增强机械强度
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申请号： US11419077申请日： 2006-05-18
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公开(公告)号： US07439624B2公开(公告)日： 2008-10-21
- 发明人: Chih-Chao Yang , Griselda Bonilla , Shyng-Tsong Chen , Kelly Malone
- 申请人： Chih-Chao Yang , Griselda Bonilla , Shyng-Tsong Chen , Kelly Malone
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理商 James J. Cioffi; Joseph Petrokaitis
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
The present invention provides an enhanced interconnect structure with improved reliability. The inventive interconnect structure has enhanced mechanical strength of via contacts provided by embedded metal liners. The embedded metal liners may be continuous or discontinuous. Discontinuous embedded metal liners are provided by a discontinuous interface at the bottom of the via located within the interlayer dielectric layer.
公开/授权文献
- US20070284736A1 ENHANCED MECHANICAL STRENGTH VIA CONTACTS 公开/授权日：2007-12-13