发明授权
- 专利标题: Acoustic wave device and method of manufacturing acoustic wave device
- 专利标题(中): 声波装置及制造声波装置的方法
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申请号: US11820223申请日: 2007-06-18
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公开(公告)号: US07439649B2公开(公告)日: 2008-10-21
- 发明人: Satoshi Fujii , Takeo Funakawa
- 申请人: Satoshi Fujii , Takeo Funakawa
- 申请人地址: JP
- 专利权人: Seiko Epson Corporation
- 当前专利权人: Seiko Epson Corporation
- 当前专利权人地址: JP
- 代理机构: Harness, Dickey & Pierce, P.L.C.
- 优先权: JP2006-172247 20060622; JP2007-007511 20070116
- 主分类号: H03H9/25
- IPC分类号: H03H9/25
摘要:
An acoustic wave device capable of exhibiting good characteristics for a prolonged period of time and a method of manufacturing an acoustic wave device are provided. An acoustic wave device of the invention includes a piezoelectric body layer having piezoelectricity and one surface, a pair of electrodes for, when electrified, inducing acoustic vibration in the piezoelectric body layer, the electrodes arranged on the one surface of the piezoelectric body layer, and a silicon dioxide layer provided in contact with the piezoelectric body layer and/or the electrodes, the silicon dioxide layer composed of silicon dioxide as its major component, wherein the silicon dioxide layer is formed by performing sputtering with a silicon dioxide target in an atmosphere of an oxygen flow rate ratio of 60% or more.
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