发明授权
- 专利标题: High-heat conductive Si-containing material and its manufacturing method
- 专利标题(中): 高导热含硅材料及其制造方法
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申请号: US11412796申请日: 2006-04-28
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公开(公告)号: US07442662B2公开(公告)日: 2008-10-28
- 发明人: Kenji Morimoto , Shinji Kawasaki , Hiroaki Sakai
- 申请人: Kenji Morimoto , Shinji Kawasaki , Hiroaki Sakai
- 申请人地址: JP Nagoya
- 专利权人: NGK Insulators, Ltd.
- 当前专利权人: NGK Insulators, Ltd.
- 当前专利权人地址: JP Nagoya
- 代理机构: Burr & Brown
- 优先权: JP2001-389459 20011221; JP2002-017373 20020125
- 主分类号: C04B35/577
- IPC分类号: C04B35/577
摘要:
A highly heat-conductive Si-containing material containing a Si phase whose lattice constant at room temperature is controlled at a level of more than 0.54302 nm but 0.54311 nm or less. Firing is conducted using a kiln material containing no B compound. With this highly heat-conductive Si-containing material and the process for production thereof, a reduction in heat conductivity can be prevented and a high heat conductivity can be exhibited stably.
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