Invention Grant
- Patent Title: Capacitor of semiconductor device and method of fabricating the same
- Patent Title (中): 半导体器件的电容器及其制造方法
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Application No.: US11316487Application Date: 2005-12-21
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Publication No.: US07442981B2Publication Date: 2008-10-28
- Inventor: Gab-Jin Nam , Young-Sun Kim , Cha-Young Yoo , Jong-Cheol Lee , Jin-Tae Noh , Jae-Young Ahn , Young-Geun Park , Jae-Hyoung Choi , Jae-Hyun Yeo
- Applicant: Gab-Jin Nam , Young-Sun Kim , Cha-Young Yoo , Jong-Cheol Lee , Jin-Tae Noh , Jae-Young Ahn , Young-Geun Park , Jae-Hyoung Choi , Jae-Hyun Yeo
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Marger Johnson & McCollom, P.C.
- Priority: KR10-2005-0008346 20050129
- Main IPC: H01L27/108
- IPC: H01L27/108 ; H01L29/94

Abstract:
Provided is a capacitor of a semiconductor device and a method of fabricating the same. In one embodiment, the capacitor includes a lower electrode formed on a semiconductor substrate; a dielectric layer formed on the lower electrode; and an upper electrode that is formed on the dielectric layer. The upper electrode includes a first conductive layer, a second conductive layer, and a third conductive layer stacked sequentially. The first conductive layer comprises a metal layer, a conductive metal oxide layer, a conductive metal nitride layer, or a conductive metal oxynitride layer. The second conductive layer comprises a doped polysilicon germanium layer. The third conductive layer comprises a material having a lower resistance than that of the second conductive layer.
Public/Granted literature
- US20060186452A1 Capacitor of semiconductor device and method of fabricating the same Public/Granted day:2006-08-24
Information query
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