Invention Grant
- Patent Title: System for different bond pads in an integrated circuit package
- Patent Title (中): 用于集成电路封装中不同接合焊盘的系统
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Application No.: US11306352Application Date: 2005-12-23
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Publication No.: US07443039B2Publication Date: 2008-10-28
- Inventor: Lun Zhao , Wan Lay Looi , Kyaw Oo Aung , Yonggang Jin , Jae-Yong Song , Won Sun Shin
- Applicant: Lun Zhao , Wan Lay Looi , Kyaw Oo Aung , Yonggang Jin , Jae-Yong Song , Won Sun Shin
- Applicant Address: SG Singapore
- Assignee: ST Assembly Test Services Ltd.
- Current Assignee: ST Assembly Test Services Ltd.
- Current Assignee Address: SG Singapore
- Agent Mikio Ishimaru
- Main IPC: H01L23/485
- IPC: H01L23/485
Abstract:
An integrated circuit package is provided with a substrate having first and second contact pads exposed through a passivation layer on the substrate. A first metallurgy layer is over the substrate. A second metallurgy layer is over the first metallurgy layer. A protective layer is over the first contact pad.
Public/Granted literature
- US20060197223A1 SYSTEM FOR DIFFERENT BOND PADS IN AN INTEGRATED CIRCUIT PACKAGE Public/Granted day:2006-09-07
Information query
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