Invention Grant
- Patent Title: Slitter blade assembly
- Patent Title (中): 分切刀片组件
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Application No.: US09843765Application Date: 2001-04-30
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Publication No.: US07444911B2Publication Date: 2008-11-04
- Inventor: Akihiro Sanda , Sampei Iida , Kenji Watanabe , Fujio Kuwabara
- Applicant: Akihiro Sanda , Sampei Iida , Kenji Watanabe , Fujio Kuwabara
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2000-133015 20000501
- Main IPC: B26D1/24
- IPC: B26D1/24
Abstract:
A disk-shaped rotary blade of a slitter blade assembly has a cutting edge and a first beveled surface facing a drum-shaped rotary blade of the slitter blade assembly and progressively spaced from the drum-shaped rotary blade toward the cutting edge. The disk-shaped rotary blade also has a second beveled surface facing a workpiece to be cut off and progressively spaced from the cutting edge away from the workpiece.
Public/Granted literature
- US20010052279A1 Slitter blade assembly Public/Granted day:2001-12-20
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