Invention Grant
- Patent Title: Electronic device
- Patent Title (中): 电子设备
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Application No.: US11183972Application Date: 2005-07-19
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Publication No.: US07445455B2Publication Date: 2008-11-04
- Inventor: Takehide Yokozuka , Masahide Harada , Shiro Yamashita , Isamu Yoshida , Masahiko Asano , Koji Sato , Shuji Eguchi , Kaoru Uchiyama
- Applicant: Takehide Yokozuka , Masahide Harada , Shiro Yamashita , Isamu Yoshida , Masahiko Asano , Koji Sato , Shuji Eguchi , Kaoru Uchiyama
- Applicant Address: JP Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Mattingly, Stanger, Malur & Brundidge, PC
- Priority: JP2004-283027 20040929
- Main IPC: H01R12/00
- IPC: H01R12/00

Abstract:
An electronic device comprises a circuit board which has a through hole and uses a resin with a glass transition temperature exceeding 150° C. as a base member, a metal casing which has an opening, and a connector which is fitted to the opening of the metal casing in which a pin of the connector is inserted into the through hole, the pin and the through hole are connected with a conductive member, and a reinforcement member for securing the connector and the board is further provided on the conductive member, thereby improving the reliability of the electronic device.
Public/Granted literature
- US20060068609A1 Electronic device Public/Granted day:2006-03-30
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