Invention Grant
US07446261B2 Flexible circuit boards with tooling cutouts for optoelectronic modules
有权
柔性电路板,带有光电模块的工具切口
- Patent Title: Flexible circuit boards with tooling cutouts for optoelectronic modules
- Patent Title (中): 柔性电路板,带有光电模块的工具切口
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Application No.: US10835832Application Date: 2004-04-30
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Publication No.: US07446261B2Publication Date: 2008-11-04
- Inventor: Dev E. Kumar , Donald A. Ice , Kinya Nippa
- Applicant: Dev E. Kumar , Donald A. Ice , Kinya Nippa
- Applicant Address: US CA Sunnyvale
- Assignee: Finisar Corporation
- Current Assignee: Finisar Corporation
- Current Assignee Address: US CA Sunnyvale
- Agency: Workman Nydegger
- Main IPC: H05K1/00
- IPC: H05K1/00

Abstract:
A flexible circuit comprises a flexible substrate having first and second opposing surfaces. The flexible substrate can include multiple layers. A plurality of electrical traces can be mounted on either or both surfaces of the flexible substrate. A plurality of electrical components can also be mounted on either or both surfaces of the flexible substrate. A plurality of tooling cutouts is recessed in the sides of the flexible circuit. The tooling cutouts can have various shapes, such as, but not limited to, semi-circular, multiple straight edges, a single or multiple curved edges, etc. The cutouts are used to position and hold the flexible circuit in at least one other device.
Public/Granted literature
- US20050045374A1 Flexible circuit boards with tooling cutouts for optoelectronic modules Public/Granted day:2005-03-03
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