Invention Grant
US07446295B2 Image sensor module having an image signal processor being physically and electrically unconnected to a supporting board of an image sensor chip
有权
具有图像信号处理器的图像传感器模块，物理和电学上不与图像传感器芯片的支撑板连接
- Patent Title: Image sensor module having an image signal processor being physically and electrically unconnected to a supporting board of an image sensor chip
- Patent Title (中): 具有图像信号处理器的图像传感器模块，物理和电学上不与图像传感器芯片的支撑板连接
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Application No.: US11532911Application Date: 2006-09-19
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Publication No.: US07446295B2Publication Date: 2008-11-04
- Inventor: Jian-Cheng Chen , Ming-Hsiang Cheng , Chia-Jung Lee
- Applicant: Jian-Cheng Chen , Ming-Hsiang Cheng , Chia-Jung Lee
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Jianq Chyun IP Office
- Priority: TW95131531 20060828
- Main IPC: H01L27/00
- IPC: H01L27/00
Abstract:
An image sensor module including a substrate, an image signal processor, a supporting board, an image sensor chip and a cover is provided. A concavity is located on a surface of the substrate. The image signal processor is disposed in the concavity e, and is electrically connected to the substrate. The supporting board is disposed on the surface of the substrate and covers the concavity. The image sensor chip is disposed on the supporting board and electrically connected to the substrate. The cover is disposed on the substrate, and covers the image sensor chip.
Public/Granted literature
- US20080048097A1 IMAGE SENSOR MODULE Public/Granted day:2008-02-28
Information query
IPC分类:
