Invention Grant
- Patent Title: Semiconductor structure and method of assembly
- Patent Title (中): 半导体结构及组装方法
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Application No.: US11257784Application Date: 2005-10-24
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Publication No.: US07446411B2Publication Date: 2008-11-04
- Inventor: Brian W. Condie , Lakshminarayan Viswanathan , Richard W. Wetz
- Applicant: Brian W. Condie , Lakshminarayan Viswanathan , Richard W. Wetz
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- Agency: Bryan Cave LLP
- Main IPC: H01L23/10
- IPC: H01L23/10
Abstract:
A semiconductor structure (100, 900) includes a substrate (110) having a surface (111) and also includes one or more semiconductor chips (120) located over the substrate surface. The semiconductor structure further includes an electrical isolator structure (340) located over the substrate surface, where the electrical isolator structure includes one or more electrical leads (341, 342) and an organic-based element (343) molded to the electrical leads. The semiconductor structure also includes a solder element (350) coupling together the electrical isolator structure and the substrate surface.
Public/Granted literature
- US20070090515A1 Semiconductor structure and method of assembly Public/Granted day:2007-04-26
Information query
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