Invention Grant
US07446633B2 Inductor circuit board, method of forming inductor, and bias-T circuit
失效
电感电路板,电感器形成方法和偏置电路
- Patent Title: Inductor circuit board, method of forming inductor, and bias-T circuit
- Patent Title (中): 电感电路板,电感器形成方法和偏置电路
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Application No.: US11654017Application Date: 2007-01-17
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Publication No.: US07446633B2Publication Date: 2008-11-04
- Inventor: Takatoshi Yagisawa
- Applicant: Takatoshi Yagisawa
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Staas & Halsey LLP
- Priority: JP2006-222069 20060816
- Main IPC: H01P3/08
- IPC: H01P3/08

Abstract:
An inductor circuit board that is made compatible with broadband by reducing parasitic capacitance of an inductor. The inductor circuit board is comprised of a flexible substrate made of a material, such as polyimide or liquid polymer, a transmission line formed on the flexible substrate, and an inductor. The inductor has a three-dimensional conical structure in which component inductors having different inductances are continuously connected to each other, with one end thereof connected to a portion of the transmission line between an input end and an output end thereof, and is formed according to a transmission line pattern by wiring on a plurality of surface layers of the flexible substrate and connecting portions wired on the surface layers by vias that connect between the layer surfaces of the substrate, such that the inductor is expanded in a fan-like manner as it is farther from the one end connected to the transmission line. A portion of the indictor closer to the transmission line has a smaller inductance, and a portion of the same farther from the transmission line has a larger inductance.
Public/Granted literature
- US20080042785A1 Inductor circuit board, method of forming inductor, and bias-T circuit Public/Granted day:2008-02-21
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