An enclosure for housing electronic equipment comprises a cabinet for receiving the electronic equipment and a cooling system, wherein the cooling system comprises a coolant circulation system including a fluid inlet, a fluid outlet, and at least one fluid coupling device in fluid communication therewith, at least two heat exchange units, each heat exchange unit comprising a liquid-cooled heat exchanger in fluid communication with the coolant circulation system via the at least one fluid coupling device and each heat exchange unit including at least one blind mating sleeve, and at least one fan positioned to blow air across the heat exchanger, the cabinet including at least one guide pin for facilitating blind connection of the heat exchange unit to the fluid coupling device, the guide pin being positioned so as to be received in a blind mating sleeve when the heat exchange units are mounted in the cabinet.