发明授权
- 专利标题： Heat dissipation device
- 专利标题（中）： 散热装置
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申请号： US11309849申请日： 2006-10-12
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公开(公告)号： US07447028B2公开(公告)日： 2008-11-04
- 发明人: Cheng-Tien Lai , Tao Li , Wei-Qiang Tian
- 申请人： Cheng-Tien Lai , Tao Li , Wei-Qiang Tian
- 申请人地址： CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- 专利权人： Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.,Foxconn Technology Co., Ltd.
- 当前专利权人： Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.,Foxconn Technology Co., Ltd.
- 当前专利权人地址： CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- 代理商 Frank R. Niranjan
- 优先权： CN200610062526 20060908
- 主分类号： H05K7/20
- IPC分类号： H05K7/20
摘要：
A heat dissipation device includes a heat sink, a fan producing an airflow flowing towards the heat sink, an air-guiding member positioned between the fan and the heat sink and a cover enclosing the fan and the heat sink. The air-guiding member includes an air deflector dividing the airflow produced by the fan into two airstreams. The air deflector guides the airstreams of the airflow flowing towards different portions of the heat sink. By the air deflector, the portion of the heat sink, which is hotter than the other portion of the heat sink, has more air flowing therethrough.
公开/授权文献
- US20080062641A1 Heat dissipation device 公开/授权日：2008-03-13