Invention Grant
- Patent Title: Vapor chamber for dissipation heat generated by electronic component
- Patent Title (中): 用于电子部件产生的散热的蒸气室
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Application No.: US11308231Application Date: 2006-03-14
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Publication No.: US07447029B2Publication Date: 2008-11-04
- Inventor: Cheng-Tien Lai , Zhi-Yong Zhou , Qiao-Li Ding
- Applicant: Cheng-Tien Lai , Zhi-Yong Zhou , Qiao-Li Ding
- Applicant Address: CN Longhua Town, Bao'an District, Shenzhen, Guangdong TW Tu-Chen, Taipei Hsien
- Assignee: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.,Foxconn Technology Co., Ltd.
- Current Assignee: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.,Foxconn Technology Co., Ltd.
- Current Assignee Address: CN Longhua Town, Bao'an District, Shenzhen, Guangdong TW Tu-Chen, Taipei Hsien
- Agent Winston Hsu
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
A vapor chamber includes a base (100) for contacting a heat-generating component (500), a cover (200), a first porous capillary sheet (300) located in the base and a second porous capillary sheet (400) located in the cover and facing the first porous capillary sheet. The base comprises a block (130) extending from the base to thermally connect with the cover. The cover is mounted on the base and forms a hermetically sealed container together with the base. The first and second porous capillary sheets together form an enclosure and are contained in the container, and the block extends through the first and second porous capillary sheets and engage therewith.
Public/Granted literature
- US20070217154A1 VAPOR CHAMBER FOR DISSIPATION HEAT GENERATED BY ELECTRONIC COMPONENT Public/Granted day:2007-09-20
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