发明授权
- 专利标题： Method for forming electroplating film on surfaces of articles
- 专利标题（中）： 在物品表面形成电镀膜的方法
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申请号： US10467349申请日： 2002-10-25
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公开(公告)号： US07449100B2公开(公告)日： 2008-11-11
- 发明人: Kohshi Yoshimura , Fumiaki Kikui
- 申请人： Kohshi Yoshimura , Fumiaki Kikui
- 申请人地址： JP Tokyo
- 专利权人： Hitachi Metals, Ltd.
- 当前专利权人： Hitachi Metals, Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Kratz, Quintos & Hanson, LLP
- 优先权： JP2001-330806 20011029; JP2002-017686 20020125; JP2002-052834 20020228; JP2002-220425 20020729
- 国际申请： PCT/JP02/11096 WO 20021025
- 国际公布： WO03/038157 WO 20030508
- 主分类号： C23C28/02
- IPC分类号： C23C28/02
摘要：
An object of the present invention is to provide a method for forming a uniform and dense electroplating film with high adhesion strength on the surface of an article, yet irrespective of the surface material and the surface properties of the article. A means for a solution of the problem comprises: forming on the surface of the article, a resin coating made of a resin containing dispersed therein a powder of a first metal; then forming a second-metal substituted plating film on the surface of the resin coating by immersing the resin-coated article in a solution containing ions of a second metal having an ionization potential nobler than that of the first metal; and further forming an electroplating film of a third metal on the surface of the metal-substituted plating film.
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