Invention Grant
US07449127B2 Cleaning method and solution for cleaning a wafer in a single wafer process
失效
用于在单个晶片工艺中清洁晶片的清洁方法和解决方案
- Patent Title: Cleaning method and solution for cleaning a wafer in a single wafer process
- Patent Title (中): 用于在单个晶片工艺中清洁晶片的清洁方法和解决方案
-
Application No.: US11145304Application Date: 2005-06-03
-
Publication No.: US07449127B2Publication Date: 2008-11-11
- Inventor: Steven Verhaverbeke , J. Kelly Truman
- Applicant: Steven Verhaverbeke , J. Kelly Truman
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely Sokoloff Taylor & Zafman, LLP
- Main IPC: C09K13/00
- IPC: C09K13/00 ; C08K13/06 ; H01L21/302
Abstract:
The present invention is a novel cleaning method and a solution for use in a single wafer cleaning process. According to the present invention the cleaning solution comprises ammonium hydroxide (NH4OH), hydrogen peroxide (H2O2), water (H2O) and a chelating agent. In an embodiment of the present invention the cleaning solution also contains a surfactant. And still yet another embodiment of the present invention the cleaning solution also comprises a dissolved gas such as H2. In a particular embodiment of the present invention, this solution is used by spraying or dispensing it on a spinning wafer.
Public/Granted literature
- US20050227888A1 Cleaning method and solution for cleaning a wafer in a single wafer process Public/Granted day:2005-10-13
Information query
