Invention Grant
- Patent Title: Wire bonded wafer level cavity package
- Patent Title (中): 接线晶圆级腔体封装
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Application No.: US11322617Application Date: 2005-12-30
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Publication No.: US07449779B2Publication Date: 2008-11-11
- Inventor: Kenneth Allen Honer , Giles Humpston , David B. Tuckerman , Michael J. Nystrom
- Applicant: Kenneth Allen Honer , Giles Humpston , David B. Tuckerman , Michael J. Nystrom
- Applicant Address: US CA San Jose
- Assignee: Tessera, Inc.
- Current Assignee: Tessera, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Main IPC: H01L23/48
- IPC: H01L23/48

Abstract:
A microelectronic device includes a chip having a front surface and a rear surface, the front surface having an active region and a plurality of contacts exposed at the front surface outside of the active region. The device further includes a lid overlying the front surface. The lid has edges bounding the lid, at least one of the edges including one or more outer portions and one or more recesses extending laterally inwardly from the outer portions, with the contacts being aligned with the recesses and exposed through them.
Public/Granted literature
- US20060220234A1 Wire bonded wafer level cavity package Public/Granted day:2006-10-05
Information query
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