发明授权
- 专利标题: LED package and fabricating method thereof
- 专利标题(中): LED封装及其制造方法
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申请号: US11489578申请日: 2006-07-20
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公开(公告)号: US07453093B2公开(公告)日: 2008-11-18
- 发明人: Yong Suk Kim , Young Soo Oh , Hyoung Ho Kim , Taek Jung Lee , Seog Moon Choi
- 申请人: Yong Suk Kim , Young Soo Oh , Hyoung Ho Kim , Taek Jung Lee , Seog Moon Choi
- 申请人地址: KR Kyungki-Do
- 专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址: KR Kyungki-Do
- 代理机构: McDermott Will & Emery LLP
- 优先权: KR10-2005-0066010 20050720
- 主分类号: H01L27/15
- IPC分类号: H01L27/15 ; H01L23/34
摘要:
The invention provides an LED package capable of effectively releasing heat emitted from an LED chip out of the package and a fabrication method thereof. For this purpose, at least one groove is formed on an underside surface of the substrate to package the LED chip and the groove is filled with carbon nanotube material. In the LED package, a substrate having at least one groove on the underside surface is prepared. A plurality of electrodes are formed on a top surface of the substrate. Also, at least the one LED chip is mounted over the substrate to have both terminals electrically connected to the upper electrodes. In addition, carbon nanotube filler is filled in the groove of the substrate.
公开/授权文献
- US20070018190A1 LED package and fabricating method thereof 公开/授权日:2007-01-25