发明授权
US07457118B1 Method and apparatus for dispersing heat from high-power electronic devices
有权
从大功率电子设备分散热量的方法和装置
- 专利标题： Method and apparatus for dispersing heat from high-power electronic devices
- 专利标题（中）： 从大功率电子设备分散热量的方法和装置
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申请号： US10740990申请日： 2003-12-19
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公开(公告)号： US07457118B1公开(公告)日： 2008-11-25
- 发明人: F. William French , Leonard A. Merrill
- 申请人： F. William French , Leonard A. Merrill
- 申请人地址： US MA Hopkinton
- 专利权人： EMC Corporation
- 当前专利权人： EMC Corporation
- 当前专利权人地址： US MA Hopkinton
- 代理商 Krishnendu Gupta; Scott A. Ouellette
- 主分类号： H05K7/20
- IPC分类号： H05K7/20
摘要：
A heat dissipation apparatus includes a heat absorption device coupled to a board, the heat absorption device configured to absorb heat generated by an electrical device mounted on the board, a heat dispersion device configured discretely from the heat absorbing device and the board for dispersing heat input thereto and a heat transporting device coupled between the heat absorption device and the heat dispersion device for transporting heat absorbed by the heat absorption device to the heat dispersion device.
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