Invention Grant
- Patent Title: Methods and systems for performing real-time wireless temperature measurement for semiconductor substrates
- Patent Title (中): 用于对半导体衬底执行实时无线温度测量的方法和系统
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Application No.: US11689384Application Date: 2007-03-21
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Publication No.: US07460972B2Publication Date: 2008-12-02
- Inventor: Sharathchandra Somayaji , Christopher L. Beaudry , David Quach
- Applicant: Sharathchandra Somayaji , Christopher L. Beaudry , David Quach
- Applicant Address: JP Kyoto
- Assignee: Sokudo Co., Ltd.
- Current Assignee: Sokudo Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Townsend and Townsend & Crew LLP
- Main IPC: G06F19/00
- IPC: G06F19/00 ; G06F17/40 ; G01K11/00

Abstract:
A monitor device includes a substrate and a plurality of temperature sensors disposed in the substrate. The monitor device also includes a processor coupled to the substrate and adapted to receive one or more signals from the plurality of temperature sensors. The processor is further adapted to convert the one or more received signals into one or more converted signals. The monitor device further includes a transceiver coupled to the substrate and adapted to receive the one or more converted signals. The transceiver is further adapted to transmit one or more output signals to an external receiver.
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