发明授权
US07465606B2 Resistance welded solder crimp for joining stranded wire to a copper lead-frame
失效
用于将绞合线连接到铜引线框架的电阻焊接焊接压接
- 专利标题: Resistance welded solder crimp for joining stranded wire to a copper lead-frame
- 专利标题(中): 用于将绞合线连接到铜引线框架的电阻焊接焊接压接
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申请号: US11541602申请日: 2006-10-03
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公开(公告)号: US07465606B2公开(公告)日: 2008-12-16
- 发明人: John William DeWys , Sergey Tyshchuk , Johannes Brouwers , Murray Van Duynhoven , John Edward Makaran
- 申请人: John William DeWys , Sergey Tyshchuk , Johannes Brouwers , Murray Van Duynhoven , John Edward Makaran
- 申请人地址: DE Wurzburg
- 专利权人: Brose Fahrzeugteile GmbH & Co. Kommanditgesellschaft, Wurzburg
- 当前专利权人: Brose Fahrzeugteile GmbH & Co. Kommanditgesellschaft, Wurzburg
- 当前专利权人地址: DE Wurzburg
- 代理机构: Manelli Denison & Selter PLLC
- 代理商 Edward J. Stemberger
- 主分类号: H01L21/44
- IPC分类号: H01L21/44
摘要:
A method of connecting stranded wire to a lead-frame body 10 includes the provision of a stranded wire 12. It is ensured that insulation is stripped from an end 14 of the stranded wire. An electrically conductive lead-frame connection structure 16 is associated with the lead-frame body. The end 14 of the stranded wire is inserted into the lead-frame connection structure 16 so that the lead-frame connection structure substantially surrounds the wire end. Solder flux is injected so as to be substantially about a portion of the end of the stranded wire. The lead-frame connection structure is placed in contact with a bottom resistance welding electrode 18 or a top resistance welding electrode 20. The electrode that is not presently in contact with the lead-frame connection structure is moved so as to contact the lead-frame connection structure to resistance weld the wire end 14 to the lead-frame connection structure 16 and thereby define a solder crimp connection 22 of the wire end and the lead-frame connection structure.
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