发明授权
- 专利标题： Method of machining substrate and method of manufacturing element
- 专利标题（中）： 基板加工方法及其制造方法
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申请号： US11300108申请日： 2005-12-14
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公开(公告)号： US07468310B2公开(公告)日： 2008-12-23
- 发明人: Yutaka Yamazaki , Kazushige Umetsu
- 申请人： Yutaka Yamazaki , Kazushige Umetsu
- 申请人地址： JP
- 专利权人： Seiko Epson Corproation
- 当前专利权人： Seiko Epson Corproation
- 当前专利权人地址： JP
- 代理机构： Harness, Dickey & Pierce, P.L.C.
- 优先权： JP2004-365516 20041217
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
A method of machining a substrate etches a substrate according to a predetermined length and depth from an intersection between a first predetermined dividing line and a second predetermined dividing line, which cross each other in a T-shaped line, along the second predetermined dividing line of the predetermined dividing lines being used to cut the substrate, and divides the substrate along the predetermined dividing lines which are not etched by laser machining.