A heat sink retention module including a frame, first and second wire modules and a latch. The frame receives a heat sink base and is securable to a circuit board. First and second wire modules each include a pair of arm sections pivotally coupled to opposing sides of the frame about a transverse axis, a transverse handle section, and a spring clip formed adjacent the pivoting end of each arm section. The transverse axis of the first wire module is longitudinally spaced apart from the transverse axis of the second wire module. When the wire modules are adducted and flexed, a generally downward force is applied to the heat sink base by the spring clips, which extend generally perpendicular to each arm section. The wire modules are kept in the adducted position by a latch selectively securable between the transverse handle sections of the first and second wire modules.